Document Type : Research Article

Authors

1 Department of Manufacturing Engineering, National Institute of Foundry and Forge Technology, Ranchi-834003, India

2 Department of Mechanical Engineering, Cambridge Institute of Technology, Ranchi 831005, India

Abstract

Present paper compares the copper electroplating on FDM (Fused deposition modelling) parts through two different routes. The two routes are: (i) Method of electroplating using chromic acid for surface preparation (ii) Method of electroplating using aluminium charcoal (Al-C) paste for surface preparation. Same plating condition is used for both the routes adapted. The result proposes that better copper deposition occurs using the Al-C paste than method using chromic acid for surface preparation.  However, it was observed that in few samples, problem of shell cracking occurs in Al-C route, the reason for which is dissolution of paste at high operating condition during electroplating. Finally, the conclusion was made that Al-C paste at suitable operating conditions can be used for electroplating of FDM processed ABS parts. Copyright © 2017 VBRI Press.

Keywords

1.Radulescu, F.; Miller, P.; Cunnane, L.; Harris, M.; Lam, H.;
Bowers, C.; Complete sputtering metallization for high-volume
manufacturing. J III-VsRev., 2002, 15, 42.

DOI:
10.1016/S0961-1290(02)85149-3
2.
Equbal, A.; Sood, A.K.; Investigations on metallization in FDM
build ABS
part using electroless deposition method. J Manuf
process
. , 2015; 19,22.
DOI:
10.1016/j.jmapro.2015.03.002
3.Equbal, A.; Sood, A.K.; Shamim, M.; Rapid Tooling: A Major
Shift inTooling Practice. J. manuf Indus. Engg.,2015, 14,1.

DOI:
10.12776/mie.v14i3-4.325.
4.Sood, A.K.; Ohdar, R.K.; Mahapatra, S.S.; Improving
dimensional accuracy of Fused Deposition Modeling processed
part using grey Taguchi method. Mater. Des., 2009; 30, 4243-
4252.

DOI:
10.1016/j.matdes.2009.04.030.
5.Sood, A.K.; Ohdar, R.K.; Mahapatra, S.S.; parametric appraisal
of mechanical property of fused deposition modeling processed
parts. Mater. Des., 2010, 31, 287295.

DOI:
10.1016/j.matdes.2009.06.016.
6.Kuzmik, J.J.; Mallory, G.O.; Hajdu,J.B.; Electroless Plating:
Fundamentals and Applications; The American and Surface
Finishers Society: Orlando, FL, USA, 1990.

7.Hanna, F.; Hamid, A.; Aal, A.;
Controlling factors affecting the
stability and rate of electroless copper plating.
Mater. Lett,2003,
58
(1-2),104-109.
DOI:
10.1016/S0167-577X (03)00424-5
8.Xu, L.; Wu, G.W.; Liu. Z.;
Preparation of copper nano particles
on carbon nanotubes by electroless plating method
. Mater Res.
Bull.,
2004, 39, 1499-1505.
DOI:
10.1016/j.materresbull.2004.04.021
9.Li, D.; Yan, C.L.; Acidic electroless copper deposition on
aluminum-seeded ABS plastics, Surf. Coat. Technol., 2009, 203,
3559-3568, 2009.

DOI:
10.1016/j.surfcoat.2009.05.026.
10.Lustraflex material safety data sheet, LEATHERTONE plastic
supply. 2009, 1-5.

11.Nicolas, D.; Pascu, M.; Vasile, C.; Poncin, F.; Influence of the
polymer pre-treatment before its electroless metallization.
Surf.
Coat. Technol
., 2006, 200, 4257-4265.
DOI:
10.1016/j.surfcoat.2005.01.095
12.Wang, X.; Li, N.; Li, Y.; Effect of Pd ions in the chemical
etching solution. J Univ. Sci. Technol. 2007,14, 286.

DOI:
10.1016/S1005-8850(07)60055-3
13.Dia, l.; Liua, B.; Songb, J.; Shanb, D.; Yangb, D.;
Effect of
chemical etching on the Cu/Ni metallization of poly (ether ether

ketone)/carbon fiber composites.
Appl. Surf. Sci., 2011, 257,
4272
.
DOI:
10.1016/j.apsusc.2010.12.035
14.O'Kelly, J.; Mongey, K.; Gobil, Y.; Torres, J.; Kelly, P.;
Room
temperature electroless plating copper seed layer process for

damascene inter level metal structures.
Microelectron. Eng.,
2000
, 50, 473-479.
DOI:
10.1016/S0167-9317(99)00317-2
15.Hong, S.; Shin, C.; Park, J.; Palladium activation of TaNx barrier
films for autocatalytic electroless copper deposition. J.
Electrochem. Soc., 2002, 149(1),85-88.

DOI:10.1149/1.1427079

16.
ASTMDesignation, D335909, Standard Test Methods for
Measuring Adhesion by Tape Test.
2010, 1.
17.Vagramyan, T.A.; Electrodeposition of alloys: mechanism of
simultaneous reaction of metal ions. Israel Program of Scientific
Translation Ltd. Jerusalem, 1970.

18.
Equbal, A.; Equbal, A.; Sood, A.K.; Metallization on FDM
processed parts using electroless procedure.
Proced. Mater. Sci.
2014
, 6, 1197.
DOI:
10.1016/j.mspro.2014.07.193