Letter to Editor
Anshuman Mishra
Abstract
Developing a large pool of research and technology data perhaps the most important source of knowledge, which can be shared among professionals to facilitate new technology development. High ranges of environmental friendly materials that have been procured from various resources have ignited significant ...
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Developing a large pool of research and technology data perhaps the most important source of knowledge, which can be shared among professionals to facilitate new technology development. High ranges of environmental friendly materials that have been procured from various resources have ignited significant interest due to their impressive properties of sustainability.
Review Article
Olivier Bonnaud
Abstract
Microelectronic technologies have progressively shifted to nanotechnologies thanks to a permanent decrease in the size of elementary devices over the last 50 years. This evolution has been achieved by decreasing the lateral dimensions of the devices, and the thicknesses of the layers involved in the ...
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Microelectronic technologies have progressively shifted to nanotechnologies thanks to a permanent decrease in the size of elementary devices over the last 50 years. This evolution has been achieved by decreasing the lateral dimensions of the devices, and the thicknesses of the layers involved in the architecture of the devices. The minimum dimensions have today reached the size of several atoms. New concepts are introduced to better control the fabrication processes and, therefore, the electrical properties of circuits and systems. In parallel, the application spectrum of microelectronics has been broadened, which allows developing complete integrated systems such as connected objects, which also broadens the necessary skills of designers in a multidisciplinary manner. Research and industry therefore have a strong need for such skills and competences. As a consequence, Higher education must continuously adapt to meet these needs. This approach requires the existence of technological platforms, which are becoming more and more expensive due to the increasing complexity of the technology and which must be shared. In France, a national network was created and organized in this way. Based on several examples of the activities of the French common centers, this paper presents how to maintain a high scientific level and skills based on the knowledge and know-how of future engineers and researchers.
Research Article
Hui Xu; Xiaolan Wang; Rui Chen; Hui Zhang; Yong Wang; Hong Jin; YU Bai; Ping Zong
Abstract
Micrometer sized silicon particles encapsulated in copper layer (SiMPs@Cu) was synthesized by a simple electroless deposition process. The pH values, copper salt concentrations and the complexing agent concentration were studied to evaluate the factors which affected the copper layer structures. The ...
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Micrometer sized silicon particles encapsulated in copper layer (SiMPs@Cu) was synthesized by a simple electroless deposition process. The pH values, copper salt concentrations and the complexing agent concentration were studied to evaluate the factors which affected the copper layer structures. The micro sized Si particles were uniformly surrounded by a layer of Cu nanoparticles which can construct a conductive network within the electrode. The final composite SiMP@Cu can be obtained after H2 treatment with a microstructure well maintained. The electrochemical properties of the composite were characterized in terms of Cyclic Voltammetry (CV), Gavanostatic charge/discharge (GCD) and Electrochemical Impedance spectroscopy (EIS). The SiMPs@Cu prepared at pH5 and with a concentration of 0.32 M Cu salt and 0.1 M complexing agent exhibited a improved specific capacity of more than 500 mA/g (at a current density of 100 mA/g) after 200 cycles, which is much better than the SiMPs without copper deposition. The result demonstrates that the copper layer can effectively alleviate the failure issue of electrode induced by Si pulverization during the charge/discharge process. This method is cost-effective and easy-to-control which illuminates a feasible strategy to fabricate Si anode with cheap micro sized Si starting material.
Research Article
Sarah Mobley; Kelly Costello; Gray Mullins
Abstract
A common method of constructing foundations for bridges or tall buildings involves deep excavations in which steel reinforcement and fluid concrete are placed while in a submerged state below the ground water table. The excavation stability is achieved by maintaining the fluid level of slurry within ...
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A common method of constructing foundations for bridges or tall buildings involves deep excavations in which steel reinforcement and fluid concrete are placed while in a submerged state below the ground water table. The excavation stability is achieved by maintaining the fluid level of slurry within the excavation well above the ground water table and thus pushes outward against the soil side walls. The most common slurry products are comprised of clay minerals mixed with water to form a thick consistency capable of suspending soil cuttings. More recently, highly engineered polymer slurry products have emerged that, if used properly, far out-perform the traditional mineral slurry products. This paper outlines test results showing the marked performance improvements. Results from concrete to soil bond, steel reinforcement to concrete bond, and corrosion durability tests are presented from multiple research projects all coming to the same conclusion: present methods that use mineral slurry may be unwittingly constructing poor foundation elements, and polymer slurry alternates result in superior end products.
Research Article
Bandana Rajpoot; Sushil Kumar Singh; Abhishek Kumar; Anuj Jain
Abstract
This study is focused to see reinforcing effects of SiO2 nanoparticles on the mechanical and thermal properties of epoxy resin. For the same, SiO2 nanoparticles up to 8 wt.% were reinforced in epoxy resin and the effect of this reinforcement was seen on fracture toughness, fracture energy and glass transition ...
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This study is focused to see reinforcing effects of SiO2 nanoparticles on the mechanical and thermal properties of epoxy resin. For the same, SiO2 nanoparticles up to 8 wt.% were reinforced in epoxy resin and the effect of this reinforcement was seen on fracture toughness, fracture energy and glass transition temperature. The particles were dispersed ultrasonically in epoxy resin, which gives well dispersion of nano-SiO2 particles. A good dispersion of silica nanoparticles enhances mechanical and thermal properties up to 4 wt.% SiO2. As a result, the value of fracture toughness increases from 1.10 to 2.90 M Pa.m1/2, fracture energy increases from 2.66 to 11.50 kJ/m2 and glass transition temperature increased about 9°C for the epoxy containing 4 wt.% SiO2 nanoparticles. With further particle loading in epoxy reflected decrease in mechanical and thermal properties, which is attributed to the significant increase in clustering of the nanoparticles at higher loading concentrations.